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Gas Plasma Dry Cleaner

PDC200/210/510

Description

High performance single stage, compact plasma cleaner suitable for R&D purposes

Features

  • Simple and compact plasma surface treatment device
  • RIE (Reactive Ion Etching) Plasma mode, with DP (Direct Plasma) mode as option
  • Excellent electrode structure for plasma uniformity
  • Simple touch panel system

Applications

  • Plasma processing of CSP, BGA, COB substratum
  • Removal of organic films and metal oxidized films
  • Dry cleaning of printed circuit board
  • Surfactant process LED assembly
  • For R&D
ModelPDC200PDC210PDC510
Plasma modeRIE (DP mode option)RIE / DP selectable
Electrode structureParallel flat stage plate
Vacuum gaugeCapacitance manometer
High frequency outputMax 300WMax 500W
Oscillation frequency13.56MHz Quartz oscillator
Output setting methodManual setting on the LCD touch panel
Matching methodAuto tuning
ControllerProgrammable
DisplayLCD touch panel
Chamber sizeW400 × D250 × H150 mmW500 × D300 × H200 mm
Stage sizeW250 × D170 mmW410 × D210 mm
Chamber materialAluminum
Reaction gas2 systems (Argon, Oxygen)
Purge gasNitrogen or dry air
Reaction gas flow controlFlow meterMass flow controller
Rotary vacuum pump (optional)~345 l/min~500 l/min
External dimensions WxDxH540×600×600 mm540×600×600 mm700×700×700 mm
Weight~100kg~105kg~180kg
Power source 50/60HzSingle phase AC100V 15A3-phase AC200V~AC240V

pdc200210510-detail

Click on the links below to download the associated PDFs.


PDC200/210/510 Catalog

To download Operational Manual, visit our Technical Support Center